太原高导热汉高ABLESTIKJM7000导电胶,乐泰导电胶

ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。

常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装

汉高ablestik JM7000高可靠性导电胶 耐高温导电胶300度

ABLESTIK JM7000耐高温300℃导电胶

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.