爱赛克底部填充胶UNDERFILL_39-ICH08

爱赛克底部填充胶UNDERFILL_39-ICH08
爱赛克底部填充胶39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.



爱赛克UNDERFILL底部填充胶39-ICH08特长：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity 1.4 @25度
Thixotropic index 1.0 12s-1/120s-1
Viscosity 4.200 mPa·s Cone plate type, 120s-1

Cured state
Property Typical Value Test Condition
Tensile Modulus 4.6 Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength 16 Mpa JIS K 6850
Volume resistivity 2.28 x 1015Ω·cm JIS K 6911
Surface resistivity 9.7 x 1015Ω JIS K 6911
Dielectric constant 3.08 1.0GHz
3.05 2.45GHz
Dielectric loss tangent 0.015 1.0GHz
0.015 2.45GHz


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衡鹏供应
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