汉高乐泰FP4549底部填充剂,海南汉高乐泰FP4549底部填充胶半导体

LOCTITE ECCOBOND FP4549 liquid epoxy adhesive is designed for
enhanced adhesion to integrated circuit passivation materials. This
material is formulated to quickly underfill devices at 90°C to 110°C with
as little as a 1/2 mil gap. When fully cured, the material forms a rigid,
low stress seal that dissipates stress on solder joints and extends
thermal cycling performance.北京汐源科技有限公司 导电胶 绝缘胶 半导体材料 划片液 键合金丝

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Linear Thermal Expansion, Sample cured 7 min @
160°C:
Below Tg, ppm/°C 45
Above Tg, ppm/°C 143
Glass Transition Temperature (Tg) by TMA, °C 140

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Linear Thermal Expansion, Sample cured 7 min @
160°C:
Below Tg, ppm/°C 45
Above Tg, ppm/°C 143
Glass Transition Temperature (Tg) by TMA, °C 140
玻璃转化温度140℃
低膨胀系数
低应力
北京汐源科技有限公司