LR603系列金属剥离胶LR603-100

产品简介

LR603 系列金属剥离胶主要应用于无

线设备、光电子芯片、MEMS 及半导体封装等

领域，作为微米级金属剥离工艺中双层剥离

工艺的显影牺牲层，LR603 系列产品适合于

内切深度＞1µm 的金属剥离工艺。

INTRODUCTION

LR603 series metal lift-off resin mainly

used in IC manufacture such as wireless

devices, optoelectronic chips,MEMS and

semiconductor packaging. As the development

sacrificial layer of the tri-layer lift-off process

in the micron metal lift-off process , LR603

series suitable for metal lift-off process with

under-cut length more than 1µm. 产品性能

 金属剥离胶膜厚 0.4-1.6μm；

 内切深度控制；

 良好的附着力；

 良好工艺兼容性；

 平坦化性能。

FEATURES

 The thickness range of LR603 series ：

0.4-1.6μm;

 The under-cut length controllable;

 Good adhesion;

 Good process compatibility;

 Excellent planarization performance. 产品型号 PRODUCT RANGE

Spin Curve Pattern Profiles

Product name LR603-100 LR603-050

Film thickness 1.6-0.8um 0.9-0.4um