汉高汉高导电胶,黔江厚膜电路汉高ABLESTIKJM7000导电胶

乐泰EA 3335透明UV耐热耐水耐腐蚀光通讯光路胶

粘度 5000-7000cp 固化条件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg温度59ppm/℃ CTE,Tg值温度 ppm/℃

透明，UV快速固化，良好的耐热，耐水，耐化学腐蚀性，低挥发。

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300ºC N/mm² 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10ºC/ minute ramp from 25 to 400
ºC
@ 340ºC, % 0.2
@ 400ºC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300ºC
Volume Resistivity, ohm-cm ≤0.01