汉高2561MM灌封胶,上海乐泰2651MM导热环氧灌封胶灌封

LOCTITE ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed areas where light is unable to penetrate. The secondary thermal cure can be done in conventional box or convection conveyor ovens.
Ablestik光通信器件胶，高透光UV胶，光纤尾胶，光纤头胶，通过双85测试，耐低温-65度。

VALTRON®UltraLux™ LF-1009-SB液体蜡粘合剂适用于直径大于2英寸的半导体和光伏晶圆基板。UltraLux™ LF-1009-SB液体蜡粘合剂具有高粘合强度、良好的耐温性和低黏性，可在设备晶圆和晶圆基板上提供可靠的薄层粘合剂

汉高LOCTITE乐泰2651 STYCAST 2651-40FR

　　EMERSON&CUMING: EMERSON&CUMING CF3350-002, EMERSON&CUMING CF3350-004，ECCOBOND 104, ECCOBOND 104 MOD2, ECCOBOND 144A, ECCOBOND 2332,ECCOBOND 2332-17, ECCOBOND 2332HF,ECCOBOND 24A/B, ECCOBOND 286A/B, ECCOBOND 45 BLACK, ECCOBOND 45 CLEAR, ECCOBOND 45LV Black, ECCOBOND 45SC Black, ECCOBOND 50126 FC, ECCOBOND A316T-16, ECCOBOND A329-1, ECCOBOND C-850-6,ECCOBOND CT-4042-1A/B, ECCOBOND DX-10C, ECCOBOND DX-20C, ABLESTIK84-1LMISR4,ABLESTIK84-1A,ECCOBOND E3200, ECCOBOND E3503-1, ECCOBOND G909, ECCOBOND UV-906, ECCOBOND G500, ECCOBOND G757, ECCOBOND UV300, ECCOCOAT U7510-1, STYCAST 1090 BLK, STYCAST 1265A/B, STYCAST 1266A/B, STYCAST 1365-55A/B, STYCAST 2651, STYCAST 2651MM, STYCAST 2762, STYCAST 2850CT, STYCAST 2850FT BLK, STYCAST 2850FT BLU, STYCAST 2850FT WHT, STYCAST 2850KT BLU, STYCAST 5954A/B,STYCAST A312-20,STYCASTF114,EMERSON&CUMING G500HF, EMERSON&CUMING G757HF-D, EMERSON&CUMING Catalyst 9, EMERSON&CUMING Catalyst 11, Catalyst 24LV, EMERSON&CUMING Catalyst 24LV, EMERSON&CUMING Catalyst Gel集电子材料、多层布线技术、表面微组装及平面集成技术于一体的微电子技术。在满足大部分电子封装和互连要求方面，厚膜技术已历史悠久。特别是在可靠小批量的、航空航天产品以及大批量工业用便携式无线产品中，该技术都发挥出了显著的优势。厚膜材料是有机介质掺入微细金属粉、玻璃粉或陶瓷粉末的混合物，通过丝网印刷工艺，印制到绝缘基板上。无机相的选择可确定厚膜成分的功能性，金属或金属合金无机相组成导体，金属合金或钉系化合物组成厚膜电阻。
在微电子领域中，用厚膜技术和薄膜技术都可以在基板上形成导体，电阻和各类介质膜层。但这两者不仅膜层的厚度不同，成膜的方式也相去甚远。