光模块PCB,高频电路板,高频混压PCB

产品领域：光模块埋容
层数：8LHDI二阶
板厚：1.60mm
工艺结构：3m+埋阻+FR-4TG170、阻抗Ω±10%
埋容+小孔0.20mm
表面处理：沉金3u”
小孔铜：25um
Product area: optical module buried
Number of layers: 8LHDI second order
Plate thickness: 1.60mm
Process structure: 3m+ buried resistance + FR-4TG170Impedance Ω ± 10%，Buried + minimum hole 0.20mm
Surface treatment: Shen Jin 3u"，Minimum hole copper: 25um