半导体超纯水抛光树脂现货

微粒含量(Fines Content)

穿过US 50 Mesh小于0.5% (Less than

0.5% passing through 50 U.S.mesh)

穿过US 50 Mesh小于0.5% (Less than

0.5% passing through 50 U.S.mesh)

总交换容量

(Total Exch. Capacity)

1.8 meq/ml minimum of

99% in hydrogen form

1.0 meq/ml minimum of 90% in hydroxide

form and less than 1% in chloride form

PH范围 (pH Range)

0 to 14

0 to 14

允许温度 (Temp. Stability)

120°C

60°C

溶解率 (Solubility)

Insoluble in all common solvents

Insoluble in all common solvents

向树脂罐中加水使液位高度在200-300mm或仅没过底部布水管,以防止装填树脂过程中底部排水装置受到冲击。但如果设备尺寸较小而拟采用树脂以浆水混合的方式填装也可不必事先加水。