SOFNGSMO-1512尺寸：16.3mm14.6mm1.8mmSIM卡连接器

外形尺寸：16.3mm*14.6mm*1.8mm
参数配置：铰链型MICRO-SIM卡座 1.MATERIAL 　　Insulator:High Temperature Thermoplastic, 　　UL94V-O 　　Contact:Copper Alloy 　　Shell:Copper Alloy 2.PLATING 　　Contact Area:Gold PLATED Over Ni. 　　Solder Tail:Sn PLATED Over Ni. 　　Shell Solder Arda:Gold PLATED Over Ni. 3.ELECTRICAL 　　Operating Temperature:-25℃ TO+90℃ 　　Current Rating:0.5mA max. 　　Contact Resistance:100mΩ max. 　　Insulation Resistance:1000MΩ min./500VDC