IC/半导体/LED封装检测解决方案WB&DB焊线AOI检测设备

（深圳）IC/半导体/LED封装检测解决方案
WB&DB焊线AOI检测设备
型号：F241/F251

主要特征 ：
1.可选的5面和6面检查
2.2.5D深度技术
3.模块化且灵活
4.64位操作系统
5.至强处理器
6.吞吐量从20,000上升到50,000上升
7.相机分辨率范围从75 fps时的5百万像素到66fps时的12百万像素

应用范围：
1.晶圆切割后进行检查以检测表面缺陷。
2.封装分离后进行检查，以检测封装，标记，引线和电镀缺陷。

TTVISION自动光学检测设备的检测方式
*2D
*2.5D
*True 3D (Z5D)

F251
Wirebond AOI Machine

Features
3D Profiling Technology
Inspects Wrebond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Boll. Wedge. Stitch and Loop Parameters
Minimum Overki & UnderWI
Modular end Scalable Design
Cost Effective
high Throughput

F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts

2D AOI技术规格
·Onload /Offload
Number of Magazines 2-7 units
Substrate Size 30(W) x 150(L) - 200(W) x 300(L)mm
Handling
Camera Indexing High Speed Servo driven XY Gantry
Substrate Indexing Mi cro-Step Step per d riven Conveyor
·Inspection Hardware
Camera Resolution 12MP Color
Lighting Multi Channel LED
Optics Low Distortion Macro Lens
Controller PC-based
·Software
Inspection Software TTVISION ©
·Operating System MS Windows 64 bit OS
·Reject Handling
Electronic Mapping
Defect Classification 99 Categories