乐泰LOCTITE3513HF底部填充胶低温快速固化
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面议
一、产品介绍:
LOCTITE ECCOBOND UF 3513HF是一款单组份环氧树脂底部填充胶水。主要有以下特性:
● Halogen-free /无卤
● One component for easy processing/单组份,操作方便
● Fast cure at moderate temperatures/中温快速固化
● Good adhesion to a variety of substrates/与多种基材有良好的附着力
● Stable electrical performanc/稳定的电气性能
二、产品应用:
LOCTITE ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
乐泰ECCOBOND UF 3513HF环氧底层填料封装材料是为CSP和BGA应用而设计的。它在中等温度下快速固化,将压力降至低其他组件。固化后,这种材料提供优良的机械和防潮性能电子元件保护特性。
三、产品技术参数
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 20 rpm 3,300
Pot Life @ 25oC, days 3
Shelf Life @ 2 to 8°C (from date of shipment)
(estimated), days 180
粘度:3300mPa·s (cP)
保质期:180天
贮存温度:2-8°C
四、使用方法:
1.将产品解冻恢复到室温之后方可使用。
2.解冻后的产品不建议再次冷冻。
3.固化温度:
30 minutes @ 80°C or
20 minutes @ 100°C or
10 minutes @ 120°C
常见单位换算
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
psi x 145 = N/mm2
MPa = N/mm2
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP